제품소개
Teflon & Ceramic
Maximizes the heat dissipation effect by embedding the copper generated inside the PCB by applying the power amplifier (RF Amp) to amplify the input signal in the wireless communication system and transmitting it to the antenna. It is the only technology
Application
· HPA, LPA
· DBS Systems, GPS Systems, Paging Systems
· PCS Base Stations, AMPS and GSM Base Stations
· LNA, LNB, Antenna
· Power Dividers / Combiners
· Filters / Couplers / Resonators / Mixers / Oscillators
인증
