제품소개

Teflon & Ceramic

Maximizes the heat dissipation effect by embedding the copper generated inside the PCB by applying the power amplifier (RF Amp) to amplify the input signal in the wireless communication system and transmitting it to the antenna. It is the only technology

Application

· HPA, LPA
· DBS Systems, GPS Systems, Paging Systems
· PCS Base Stations, AMPS and GSM Base Stations
· LNA, LNB, Antenna
· Power Dividers / Combiners
· Filters / Couplers / Resonators / Mixers / Oscillators

인증

제품 바로가기

keyboard_arrow_leftkeyboard_arrow_right