Product
Teflon & Ceramic
Maximizes the heat dissipation effect by embedding the copper generated inside the PCB by applying the power amplifier (RF Amp) to amplify the input signal in the wireless communication system and transmitting it to the antenna. It is the only technology
Application
· HPA, LPA
· DBS Systems, GPS Systems, Paging Systems
· PCS Base Stations, AMPS and GSM Base Stations
· LNA, LNB, Antenna
· Power Dividers / Combiners
· Filters / Couplers / Resonators / Mixers / Oscillators
Certification
Specification
Base Material | FR-4 , Ceramic , Teflon | |
No. of Layers | 1 ~ 2 L | |
Board Thickness | 64 ~ 128 [mil] | 1.6 T ~ 3.2 T |
Min. Pattern Width | 4 [mil] | 0.1 [㎛] |
Min. Pattern Space | 4 [mil] | 0.1 [㎛] |
Min. Drill Size | 12 [mil] | 0.2 [mm] |
Min. Laser Drill Size | ||
Surface Treatment | ENIG | |
Impedance Control | 10%[When you request] | |
