Product

Teflon & Ceramic

Maximizes the heat dissipation effect by embedding the copper generated inside the PCB by applying the power amplifier (RF Amp) to amplify the input signal in the wireless communication system and transmitting it to the antenna. It is the only technology

Application

· HPA, LPA
· DBS Systems, GPS Systems, Paging Systems
· PCS Base Stations, AMPS and GSM Base Stations
· LNA, LNB, Antenna
· Power Dividers / Combiners
· Filters / Couplers / Resonators / Mixers / Oscillators

Certification

Specification

Base Material

FR-4 , Ceramic , Teflon

No. of Layers

1 ~ 2 L

Board Thickness

64 ~ 128 [mil]

1.6 T ~ 3.2 T

Min. Pattern Width

4 [mil]

0.1 [㎛]

Min. Pattern Space

4 [mil]

0.1 [㎛]

Min. Drill Size

12 [mil]

0.2 [mm]

Min. Laser Drill Size


Surface Treatment

ENIG

Impedance Control

10%[When you request]


PRODUCT

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