Product

Single & Double Side

It is a product that connects the upper and lower double-sided circuits through the through hole. As high-density component mounting technology is required, the miniaturization and high integration of the via-holes are being implemented.

Application

General Electronics, Telecommunications and Home Appliances (Set Top Box, Digital TV, Car Audio, etc.)

Certification

Specification


Base Material

FR-4 , Harogen Free , RoHS

No. of Layers

1 ~ 2 L


Board Thickness

24~ 128 [mil]

0.6 T ~ 3.2 T

Min. Pattern Width

3.2 [mil]

80 [㎛]

Min. Pattern Space

3.2 [mil]

80 [㎛]

Min. Drill Size

8 [mil]

0.2 [mm]

Min. Laser Drill Size


Surface Treatment

ENIG , OSP , HASL

Impedance Control

10%[When you request]


PRODUCT

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