Product
Single & Double Side
It is a product that connects the upper and lower double-sided circuits through the through hole. As high-density component mounting technology is required, the miniaturization and high integration of the via-holes are being implemented.
Application
General Electronics, Telecommunications and Home Appliances (Set Top Box, Digital TV, Car Audio, etc.)
Certification
Specification
Base Material | FR-4 , Harogen Free , RoHS | |
No. of Layers | 1 ~ 2 L | |
Board Thickness | 24~ 128 [mil] | 0.6 T ~ 3.2 T |
Min. Pattern Width | 3.2 [mil] | 80 [㎛] |
Min. Pattern Space | 3.2 [mil] | 80 [㎛] |
Min. Drill Size | 8 [mil] | 0.2 [mm] |
Min. Laser Drill Size | ||
Surface Treatment | ENIG , OSP , HASL | |
Impedance Control | 10%[When you request] | |
